Customization: | Available |
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Technics: | Semiconductor IC |
Outer Lead: | High Temperature Resistant Soft Lead |
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Signal Type | Packing | Outer Lead | Magnetic Flux Density(mT) | Output Voltage(V) | Pulse Width (μs) |
Operating Frequency(Hz) | Internal Resistance (Ω) |
Dimension (mm) |
Operating Temperature(ºC) |
WG112 | Epoxy potting, plastic shell | Tinned copper hard lead | 5~10 | ≥1.5 | 12 | 10k | 800 | 12.8×4.5×4.5 | -40~125 |
WG113A | Epoxy potting, plastic shell | Tinned copper hard lead | 5~10 | ≥1.5 | 15 | 10k | 1000 | 12.8×4.5×4.5 | -40~85 |
WG214 | Epoxy potting, plastic shell | High temperature resistant soft lead | 5~10 | ≥1.5 | 12 | 10k | 850 | 12×7.2×8 | -40~125 |
WG216 | Epoxy potting, plastic shell | High temperature resistant soft lead | 5~10 | ≥1.5 | 12 | 10k | 1000 | Refer to datasheet | -40~85 |
WG311 | Epoxy potting, aluminum shell | Tinned copper hard lead | 5~10 | ≥1.5 | 12 | 10k | 1000 | φ4×11.5 | -40~125 |
WG314 | Heat-shrink tube | Tinned copper hard lead | 5~10 | ≥1.5 | 12 | 10k | 650 | φ3.3×22 | -40~100 |
WG315 | Heat-shrink tube | Tinned copper hard lead | 5~10 | ≥1.5 | 12 | 10k | 1300 | φ3.3×22 | -40~100 |
Power Type | Packing | Outer Lead | Magnetic Flux Density(mT) | Output Voltage(V) | Pulse Width (μs) |
Operating Frequency(Hz) | Internal Resistance (Ω) |
Dimension (mm) |
Operating Temperature(ºC) |
WG631 | Epoxy potting, aluminum shell | Tinned copper hard lead | 8~12 | ≥5.0 | 14 | 1k | 270 | 24×7×8.2 | -40~125 |
Name | Symbol | Value | Unit | |
Excitation strength | Min. | B | 3 | mT |
Typ. | 5~6 | |||
Max. | 12 | |||
Pulse signal amplitude | Vo | ≥1.5 | V | |
Pulse width(in the location of 1V) | τ | 10~30 | μS | |
DC internal resistance | Ro | 600~800 | Ω | |
Operating frequency | Min. | f | unlimited | kHz |
Max. | 10 | |||
Operating Temp. | T | -40~+125 | ºC | |
Outline Dimension and Typical installation location | - | See the figure | - | |
Sensitive silk location(distance to the bottom surface of sensor) | D | 2.0(distance to the bottom) | mm | |
Package | - | Aluminum shell, Epoxy potting | - | |
External lead | - | Tinned copper hard leads | - |